Pcb Thermal - Mechanical Reliability Of Experimental And Finite Element Simulation Study

Because there are a lot of different material joints between the Integrate Circuit and the Printed Circuit Board, the heats of Parts of an apparatus will result thermal distortion and thermal fatigue, and then, it will lead to thermal and mechanical coupling. The working temperature of semiconductor lie in dissipation power, environment temperature and condition of elimination of heat, the temperature and heat stress affect greatly the Reliability and electrical performance of apparatus.In this paper, the combining way of experimental method and Finite Element Method (FEM) is applied in studying the thermal distortion and temperature distribution of the BJ016E power amplifier and support circuit made by the Peking orient electron corporation. The distortion of whole apparatus is heave in the middle and concave in both sides when the temperature raise. The deformation trait and distributions of the heat can be get by experiment test and the 3D temperature field and thermal stress can be computed by using the mold type of 3-D SOLID90 and 3-D SOLID92 of the FEM software ANSYS5.7. So the distribution of deformation, strain and stress can be get. At same time, the deformation vector picture, Max. and Min. of stress and strain can be get too.By using the combining way of experimental method and Finite Element Method (FEM), it can realized the comprehensive analysis of the thermal-force coupling of the PCB and radiator and can provided us with experimental data for the design of the electronic packages, which was significant.