Studyand Preparation Of Solvent-free Epoxy Adhesives With High Temperature Resistance

Epoxy resin adhesive has a series of excellent properties, such as high adhesive strength, lowshrinkage rate, excellent electrical performance,not pollute the environment and so on.It has animportant role in the synthesis of adhesive both in performance and application. Therefore, it is ofgreat significance to synthesis high performance epoxy resin adhesive. But its has some shortages,such as high crosslinking density, poor weather resistance and poor toughness.It is necessary toincrease the toughness and high temperature resistance. At present, much attention has been paidto improve the thermal stability of epoxy resin adhesives and it has become hot topics in the studyof epoxy resin.2,2-bis [4-(4-aminophenoxy) phenyl] propane(BAPOPP) and epichlorohydrin are used toreact in this research,production a new type of multifunctional epoxy resin TGBAPOPP.This resinhas high temperature resistance, as well as good stability, transparency.The epoxy resin can beused as matrix resin for high performance composite materials. Then under the condition ofsolvent-free to increase the toughness and high temperature resistance,in order to prepare hightemperature resistant epoxy adhesive.This topic mainly has the following several parts:First, synthesis high temperature resistance epoxy resin,characterization and study itsproperties.Second,Preparation and properties of solvent-free type adhesive system high temperatureresistant epoxy adhesive.Third, Preparation and properties of mixed resin high temperature resistant epoxy adhesive.To start with,2,2-bis [4-(4-aminophenoxy) phenyl] propane(BAPP), water and catalyst mixedtogether as the raw materials.Then drop the epoxy chloropropane for ring opening reaction.Following,start reaction with30%aqueous sodium hydroxide solution, finally we can getthe transparent and red brown TGBAPOPP product though the post-treatment methods such asextracting, washing, distillation under pressure and so on.The infrared,epoxy value,volatile,viscosity tracking matter of the product were tested.Secondly, choose bismaleimide(BMI)to modified epoxy resin, add active chain extender D248,CE-793-250for the thinner.Preparation aseries of different ratio of high temperature resistant solvent-free epoxy resin adhesive. Researchshows that when the proportion of epoxy resin and BMI and active chain extender D248for10:4:1,the epoxy resin adhesive has the best proportion.We call this epoxy resin adhesives JA-7.Then we have some study on JA-7about the infrared analysis, tracking test viscosity, gelationtrack test, the tensile shear strength test, the surface contact Angle, electrical performance test,thermo-gravimetric analysis, differential scanning hot, etc.Research shows that the adhesiveviscosity will gradually increase with the time and curing in five days. Tensile shear strengthreached the20.4MPa at200℃. Apparent activation energy of81.8kJ/mol, bibulous rate is0.64%, the surface can be49.4mJ/m2, dielectric loss between0.005to0.006. Thermo-gravimetricresults show that in329℃the epoxy resin adhesives is decomposed by5%. DSC curing kineticswas studied and determined the best curing process. Finally, mixing with two kinds of epoxy resinand preparing three different kinds of epoxy resin adhesive,testing the viscosity,electricalperformance, tensile properties,surface energy,the apparent activation energy and water absorptionof these three kinds of adhesives.