Ultrasonic Embossing Polymer Forming Process And Optimization

In the field of micro structure of the polymer processing, ultrasonic embossing technology is a new micro fabrication technology. Compared with many traditional micro structure processing technology, it has a lot of advantages, such as clean and environmental protection, resource saving, simple operation and other advantages. Comprehensive consideration, this forming technology plays a significant role in promoting the manufacturing technology of social construction in China. At present, ultrasonic technology has been widely used in industrial, electrical, aerospace, product packaging, the micro sealing and so on. However, the application of ultrasonic manufacturing technology in polymer micro forming field is still in the stage of laboratory research. The controllability of the process is good or bad, window size, uniformity of the shape, bubble defects are not clear.Research on the controllability and process window of ultrasonic welding technology experiment are not clear. In this paper, on the basis of currently available ultrasound imprint technology, the energy model as the basis, forming results contrast between different modes. I analyzed the results to explore the influence of different control modes forming the window width of the ultrasonic embossing process and designed a set temperature contrast experiments to get the better control mode.Based on the ultrasonic embossing experimental results on different control modes, discussed the problems of polymer surface uniformity. Further comparative analyzed the quality problems under different control modes of ultrasonic embossing forming results. Through the experiment, the ultrasonic energy of 850J and 950J, the uniformity of the contact area in time control mode is better.In the dry etching process, we aimed at analyzing the diffrent micro structure in ultrasonic embossing experiments. This paper made a detailed description of the production process in dry etching and showed the etching results. Based on the difficulty of stripping in the ultrasonic experiment, making a layer of mold release agent on the mold to ensure that the polymer substrate on the mould stripping smoothly. Through the finite element simulation platform carried the stress distribution analysis of the different microstructures. It provides a reference for diffrent microstructures in ultrasonic embossing experiments under dry etching process.In order to make the polymer micro ultrasonic embossing process into the social life as soon as possible, we also discussed the problem of air bubble defect of polymer micro devices.To study the mechanism of bubble generation and movement, and put forward the corresponding method to suppress the bubble generation, mainly in the decrease of temperature and the increase of the static pressure.