Research On The Rule Of Cu/Al Surface Morphology Based On Diffusion Control Impact On The Properties Of Composite Plate

Composite is composed by two or more materials with different properties, a material with some new macroscopic properties and bonded by the physical or chemistry method. Different materials exploit the advantages to the full and realize synergistic effect reciprocally. The comprehensive properties of the composite are superior to its component material, and it can satisfy different needs. The requirement of composite properties is improving continually while technology and economy are both developing at top speed. So producing the composite with a variety of function has a important significance. In this paper, Cu/Al-Zn and Cu/Al-Si composite plate are produced by cold-rolling bonding. Effect of different roll process, heat treatment temperature and content of alloying element on interface microstructure, diffusion, mechanical and electrical properties of the composite plate is analyzed and summarized. The conclusions are as follows:1. In Cu/Al cold-rolling bonding process, higher rolling reduction rate has the benefit of fracture of the oxide films at contact surface and the exposure of fresh metals in the matrix, enhance the interface peel strength, and create conditions for elements diffusion during heat treatment process. But it reduces the electric conductivity2. Higher asynchronous speed ratio results in more shear strain and heat by deformation. It enhances the plastic deformation speed of the rolled piece, makes the interface straighter and the peel strength higher.3. The combination of the bonding interface changes from physical condition to metallurgy condition during heat treatment process after rolling. When annealing temperature is not higher than 300℃, it has the benefit of enhancing interface peel strength. When annealing temperature is beyond 300℃, the thickness of the diffusion layer enhances obviously with the increasing of annealing temperature, and multifarious Cu/Al intermetallic compounds appear. The hard and crisp intermetallic compounds reduce the interface peel strength and the electric conductivity.4. Adding zinc element into the aluminum matrix can promote interface diffusion and contributes to accomplishing the metallurgy bond. It has the benefit of interface peel strength. When annealing temperature is higher than 300℃, the appearing of a mass of intermetallic compounds reduce the interface peel strength and the electric conductivity. Adding silicon element into the aluminum matrix can control the elements diffusion at interface, but the controlling gradually weakens with the annealing temperature increasing. More silicon content has adverse effect on the interface peel strength and the electric conductivity...