Font Size: a A A

Research On The Thermal Property Of Silicone Resin Modified By Graphene Loaded Nanopaticles

Posted on:2016-03-05Degree:MasterType:Thesis
Country:ChinaCandidate:S HeFull Text:PDF
GTID:2191330479990732Subject:Polymer Chemistry and Physics
Abstract/Summary:PDF Full Text Request
With the rapid development of science and technology, silicone resin as a kind of new material is widely applied in the f ield of aviation, aerospace, electronics and other advanced field. In response to the stringent physical property demands in the aforementioned field, improving resin cross- linking degrees or adding other packing is regarded as the key to develop superior mechanical properties and high temperature resistant performance. Silicone resin is generally cured at high- temperature and the polymerization among polyfunctional monomers and oligomers is init iated by ultraviolet light which due to its unique advantages can convert the solvent- free liquid resin to be solid resin at room temperature in a most effective manner. The addition of a certain amount of highly dispersed nanoparticles in the system can effectively combine the property of nanoparticles with that of the ultraviolet light being rapid-curing and solvent- free, ult imately obtaining an inorganic-organic nano composite system with outstanding performance. In this paper, the effect of different composite nanoparticles on the curing mechanism of silicone resin system in high temperature and UV curing and the thermal stability of the composite nanoparticles is studied.At first a two-step method is adopted. Co3O4/rm GO is synthesized at high- temperature and analyzed by FT-IR, Raman, XRD, SEM and TEM etc. ammonia is found in the synthesis process to adjust the Co2+ hydrolys is and oxidation and the structural changes of graphene, obtaining n-doped graphene oxide nanoparticles composite Co3O4/N-rm GO. TG analysis indicates that the load of Co3O4 in Co3O4/rm GO and Co3O4/N-rm GO was 40% and 70%. In the study of thermal decomposition kinetics of C o3O4/rm GO, the init ial temperature is lifted from 185℃ to 235℃, with thermal decomposit ion activation energy E1 being 87.95247 k J/mol and E2 being 248.7991 k J/mol.The gamma methyl propylene acyloxy propyl trimethoxy silane, methyl triethoxysilane and dimethyl diethyl alkoxysilane co hydrolys is and condensation by propylene acyloxy silicone resin, and by nuclear magnetic resonance(N MR), gas phase means of gel permeation chromatography(GPC) confir med the synthetic resin structure for three-dimensional network structure and the optimal reaction condit ions. O n the UV curing propylene acyloxy silicone resin for kinetic studies, in 20mw/cm2 power and the thickness of the sample for 10μ m initiated by ultraviolet light dose 1wt% condition, propylene acyloxy silicone resin each free radical is connected to the number of elements is 1153.By adjusting the ratio of C2H5 O H/H2 O in the hydrothermal condition, the Ti O2 nanoparticles with different particle sizes were obtained, and the addition of H2SO4 to the selective growth of Ti O2 on the rm GO. The 10 nm Ti O2/rm GO nanoparticles were higher than the 100 nm curing time and final conversion, the amount of the composite nanoparticles was 5%, the final conversion rate was the highest, and the curing time was 15 s.
Keywords/Search Tags:Composite nanoparticles, silicone resin, curing behavior, kinetics
PDF Full Text Request
Related items