Gold Wire Bonding Quality Of Information Research

Analyzing the main influence factors of wire bonding, the experimental projects are designed by homogeneous design. Through bonding experiments of 18 um and25um gold wire, the pull strength of gold wire is measured and the images of bonds areachieved.By using BP network technology, a prediction system of the quality of wire bonding is established. The pull strength of bonds were simulated and predicted with the system. The research shows: There are good correlations between the predicted results and the experimental datum. The error is under 10%. That BP network used for predicting quality of wire bonding is feasible and valid.A window of quality information was established. Processing parameters are optimized through this window, under which the reliability of bond is tested.Using digital image processing technology, the geometrical characters of bond are detected. Through researching the relation of bond's shape and quality, It is known that the width of bond controlled in a certain range, good pull strength of bond can be achieved.