Microstructure Simulation Of The Thermal Continuous Unidirectional Solidification Process

The evolution of microstructure and the effect of parameters on it are researched. The macro-microcosmic model of microstructure simulation with 3D CA model, in the OCC process, has been developed. The competent growth of grains in the OCC process and the effect of different parameters on it have been simulated.At the macroscopic level, the heat diffusion equation is solved with a DFDM implicit scheme. The microcosmic simulation involves a 3D CA model, takes into account nucleation of new grains in the undercooled melt and the kinetics of the dendrite tips. According to the character of solidification of the OCC process, a dynamic macro-microcosmic coupling arithmetic has been proposed and it promotes the efficiency of the macro-microcosmic coupling simulation, in which the microcosmic simulating section is defined by the moving of the solid-liquid interface. With the model, a simulator has been build in Microsoft Visual C++ 6.0?system, which can reappear the process of the grain's eliminating through selection in the OCC process on the screen of computer.Compared the results of the simulator with those of the experiment, it is confirmed that simulator has successful simulated the process of the OCC. The computer simulation method is effective and feasible to study the microstructure formation in solidification.