Rolling The Composite Of Cu / Mo / Cu Electronic Packaging Materials

To meet the fast development of electronic industry, electronic packaging materials should have excellent integrated properties. Cu/Mo/Cu cladding sheets have the required properties. Cu/Mo/Cu electronic packaging materials were prepared successfully by roll bonding in this paper. The processes of the Cu/Mo/Cu electronic packaging cladding sheets were investigated. The mechanical properties of the laminates were measured, and the microstructure of Mo/Cu interface was observed by using optical microscope (OM) and scanning electron microscopy (SEM). What's more, the mathematical models for the forecasting of composite properties were discussed. The results showed that:(l)The processing methods of the mating surfaces have an important effect on the cladding sheets. The shear strength of the Cu/Mo interface of the cladding sheet treated with sandblasting plus chemical method had the highest values, and the cladding sheet treated only with normal chemical method had the lowest shear strength.(2) The roll-bonding temperatures and the first reduction had a fundamental effect on the properties of the cladding sheets. The cladding sheets had optimal properties when rolled at 850℃with the first reduction of 50%.(3) The annealing temperatures had an important effect on the properties of the cladding sheets such as thermal conductivity and shear strength. The cladding sheets annealed at 850℃ had the best integrated properties.(4) The diffusion did not happen between the surfaces of the Cu/Mo/Cu electronic packaging cladding sheets. The bonding mechanisms of the interface of Cu/Mo/Cu cladding sheets treated with sandblasting plus chemical method were composed of the fracture of surface membrane and hardened surface, energy activation and mechanic joggle of the mating surfaces.(5)During the further processing of Cu/Mo/Cu laminates, it showed that higher rolling temperature can improve the tensile strength andin-plane electric conductivity and lower rolling temperature was in favor of good surface quality and resistance to bending.(6) It was found that the theoretical predictions of the cladding ratio equation and improved classical models for forecasting electric conductivity, thermal conductivity and coefficients of thermal expansion of Cu/Mo/Cu cladding sheets established in this paper were in good agreement with the experimental measurements. It becomes clear that the proposed equations were applicable for the predictions of composite properties...