New Heat-resistant Composite Matrix Resin

In this thesis two kinds of thermosetting monomers , N-(4-allyloxyphenyl) maleimide (4-APM) and N-(4-propargyloxyphenyl) maleimide (4-PPM), were synthesized firstly. Their structures were confirmed with FT-IR sepstra, 1H-NMR and elemental analysis. And the thermal properties of the cured monomers were characterized by TGA and DMA. The blend of 4-PPM and PAA resin was also studied, and the thermal properties of the cured blends was evaluated by TGA and DMA.The main results are as follows:1. A new molecular 4-APM was synthesized. It had maleimide group and allyl group at one molecular. The 4-APM was confirmed by FT-IR sepstra, 1H-NMR and elemental analysis. The DSC curve indicated that the 4-APM was melted about 102-105 oC and the 4-APM cured at the range of 200 to 300 oC. The result indicated that the monomer presented excellent process ability. The TGA characterization indicated its onset decomposition temperature was 414 oC, and the residue mass was 51% at 900 oC. The DMA characterization indicated that its Tg was 322 oC. The thermal properties and thermal mechanical properties of cured resin were higher than commercial blended BMI systems.2. A new molecular 4-PPM was synthesized.It had maleimide group and propargyl group at one molecular. The 4-PPM was confirmed by FT-IR spectra, 1H-NMR and elemental analysis. The DSC curve indicated the 4-APM was melted about 122 oC .And the 4-PPM cured at the range of 220 to 300 oC. The result indicated that the monomer presented excellent process ability. The TGA characterization indicated its onset decomposition temperature was about 400oC, and the residue mass was 57.1% at 900 oC. The DMA characterization indicated that its Tg was 387 oC. The thermal properties and thermal mechanical properties of cured resin were higher than commercial blended BMI systems.3. The blend of 4-PPM and PAA resin was studied. The cure behaviors of 4-PPM-PAA blends were characterized by FT-IR sepctrum and DSC. Thermal stability of the cured blends was also evaluated by TGA and DMA. The TGA characterization...