Nano-cuo Composite Propellant Dispersion

In this dissertation, a research has been made on the dispersion of nanometer CuO in composite propellant, and compared with micron CuO. Firstly, nanometer CuO and ammonium perchlorate (AP) were mixed by using ball milling machine, the dispersion of nanometer CuO/AP composite particles were investigated by Transmission Electron Microscope (TEM), X-ray Diffraction (XRD), Brunnauer-Emmet-Teller (BET).Secondly, the effect on heat of combustion, explosive heat and burning rate-pressure exponents has been studied by the dispersion of nanometer CuO in composite propellant. For the same sample, the dispersion of nanometer CuO in composite propellant could be reflected by the combustion energy performance of different regions. Simultaneously, the content of copper in solution system was tested by titration after the incomplete combustion of liquid, which could reflect the dispersion of nanometer CuO in composite propellant, and compared with micron CuO. The results show that the nanometer CuO/AP nipping with 2 hours has the best explosive heat average in composite propellant, the nanometer CuO/AP nipping with 4 hours has the best combustion heat average in composite propellant, moreover, the burning rate of composite catalyze nipping with 4 hours is better than separate catalyze. At the pressure of 3.0MPa, 6.0MPa and 8.0MPa the burning rate increased respectively by 28.49%, 15.34%, 12.71%, and the pressure exponents decreased by 15.44% compared with the separate catalyze nipping with 1 hour. The dispersion of nanometer CuO in composite propellant has an effect on the combustion energy performance.Finally, the catalytic effect of composite propellant was investigated by the dispersion of nanometer CuO. Compared with the blank sample, the high exothermic peak of nanometer CuO/AP and micron CuO/AP nipping with 4 hours drops down respectively by 101.01℃and 95.78℃. The results show that the most dispersive nanometer CuO/AP could hasten better the thermal decomposition of composite propellant than micron CuO/AP.