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Part Of The Low-voltage Circuits In Electronic Ballasts Analysis And Design

Posted on:2006-12-07Degree:MasterType:Thesis
Country:ChinaCandidate:G P WeiFull Text:PDF
GTID:2192360152998558Subject:Microelectronics and Solid State Electronics
Abstract/Summary:PDF Full Text Request
As an important energy-saving product, the high-frequency electronic ballast is more and more attracted in many countries. Many International states have made fluorescent lamp ballast using Smart Power Integrated Circuit (SPIC), such as IR corp.'s IR215X series products. The advantage of SPIC is high-reliability, but the high-cost will be a bottleneck to progress. In our project, we use the patent of Xingbi Chen instead of the method of medium insulation or pn junction insulation (that is not using international BCD technology). We use the method to make high-voltage (power) device and low-voltage CMOS or BiCMOS circuit in the same chip, which makes the cost of SPIC falling. The primary work of this paper is to analyze and design low voltage control circuits, part of devices and layout of electronic ballast. The low voltage control circuits include bandgap reference, low voltage supply, under voltage lockout, over current protection. All these circuits were simulated with Cadence. After taped out, the mistakes of circuits were analyzed again and corrected.
Keywords/Search Tags:electronic ballast, SPIC, voltage reference, low voltage source under, voltage lockout, over current protection
PDF Full Text Request
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