The Thermal Design Of High-g Acceleration Sensor Microarray Study

The thermal design of electronic equipment is always the important complication in system reliability .As the maturation of MEMS manufacture, the micromation velocity of electronic equipment is expedite,integration degree is rapid improved,but the power dissipation of products is larger then before, this make he heat flux density rapid expanding,so the thermal design of systems is becoming a quite austere problem.This paper is just based on this problem, and did some researches in high heat flux density, micro-dimension combining with the thermal problem of high-g microarray accelermoter,it made the thermal problem of this sensor being solved profect faultlessly,and gained some conclusions about thermal design in micro-dimension through experiments, major of them are:1. The water flow resistance in three section shapes of microchannels was calculated,and their influence degree was gained.2. The water flow resistance in three same section shapes of being designed microchannels was calculated,and the influence degree of microchannel's length was gained.3. The thermal simulations in rectangular section of one channel and more channels were done,the profect design was gained.4. Designing one thermal system for one radar antenna, through theoretical analysis, the optimal value of rib height was gained for the liquid cooling system.5. The experimental results proved that the thermal system of microstructure can slove the heat flux density up to 150W/cm2 completely.6. The theoretical analysis is proved to be right in Laminar Flow by the experimental results,and when the equivalent diameter is 0.5mm, the macroscopic heat transfer theory is not affected by the scale effect. The article has a great value for the design of electronic equipment liquid cooling system.