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New Thermosonic Flip Bonding Power Drive System

Posted on:2009-08-13Degree:MasterType:Thesis
Country:ChinaCandidate:L ZhuFull Text:PDF
GTID:2192360245983504Subject:Mechanical and electrical engineering
Abstract/Summary:PDF Full Text Request
To be an advancing technology in capsulation, there is a well developing foreground for the thermosonic flip-chip bonding. In order to achieve high quality and efficiency of thermosonic flip-chip bonding, the power system of supplying ultrasonic needs to be provided with the function of frequency self-tracking and real-time power adjustment.Basing on analyzing the functional demands of thermosonic flip-chip bonding and the existing research works, a new-style power system for thermosonic flip-chip bonding is researched and manufactured with the digital control technology. Compared with the classical, the power system studied in this thesis has high transfer speed, high precision, strong ability of self-adjustment, the digital frequency tracking system with good temperature stability and anti-jamming capability by the application of PI and DPLL. What's more, it is also with the function of real-time adjustment,which is not existed in the other ultrasonic power system,achieved by DDS technology.The primary work and research results introduced in this thesis including:1 .According to the mechanical & electrical equivalent theories and the analysis of the electrical speciality about the transducer, we can conclude that the syntonic amplitude can be expressed by the phase of the voltage and the electricity. Based on the conclusion, frequency self-tracking is achieved with the elements of phase-locked loop.2.The math model of Phase-Locked Loop for frequency auto-tracking was built. And the three-order PLL's stability and tracing characteristic were reaserched. Aimed at solving the disadvantage of traditional PLL,a new frequency tracing method based on PI control and DPLL is conceived.3.We researched the holistic strategy about the frequency auto-tracking system in the power system, founded the hardware circuit and the control module of software whose core is MSP430F149 MCU,and achieved the ructions of real-time controlling in power adjustment, frequency auto-tracking and bonding timming control, with the combine of the hardware and the software. 4.Run and debugged the power system in the way of both modules and the whole. to verify the hardware circuit by the test, and put forward the solve methods according to the problems in the program running process; to test and verify the frequency tracking control system, the results indicated that the system we designed can exert its function reliably and effectively; to make a practical test about the real-time adjustment effect of the power source and the results proved that it can meet the design's demand.
Keywords/Search Tags:thermosonic flip-chip bonding, power system, frequency auto-tracking, the power real-time adjustment, PI+DPLL
PDF Full Text Request
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