Finned Micro Channel Heat Sink Thermal Characteristics And Applied Research

In recent years, with the light, thin, short and small electronic chip, the development trend of the chip's heat flux increasing the reliability of electronic chips to bring a greater threat. Electronic chip's thermal analysis and design study is to the key to improve the reliability of chip. Currently the main measures to improve the heat dissipation of electronic chips are the use of the heat sink. Therefore, thermal analysis and optimal design to the heat sinks has a great significance for improving the thermal performance and cost savings.In this paper, with the current demand for electronic chip cooling, using fluid dynamics finite element analysis software (FLO EFD.Pro 9.0), conduct a detailed thermal analysis to the fin heat sinks which are used widely and discuss the influence of structural parameters to the heat sinks'cooling performance in the conditions of natural convection. Simulation results show that the important factors of influencing fin heat sinks'cooling effect are fin pitch, fin thickness, base thickness and fin height. Obtain the law of how structure size Parameters affect the heat radiating, it can also provide some reference for the design of new fin heat sink.The flow and heat transfer of the microchannel heat sinks was also calculated by using the fluid dynamics finite element analysis software (FLO EFD.Pro 9.0). Discuss the flow and heat transfer characteristics in S-shaped microchannel with the different cross section's aspect and in different shape and size structure of the microchannel by using the water as the cooling medium. Optimum channel aspect ratio is 1:2. Then designed two new microchannel heat sinks, analyzed and optimized the two new microchannel heat sinks'flow and heat transfer performance. Simulation results show that the new microchannel heat sinks have a better flow and heat transfer characteristics.Finally, the optimized fin heat sink and the microchannel heat sink were applied in the SBC box; combined air-cooled cooling and liquid cooling system, and described vent position, the heat sink arrangement, and air route design's principles in the actual system applications.