The Microchannel And Fin Heat Sink Heat Transfer Characteristic Research With The Ship LED Radiator

Ships sailing in the water, with a long period of high temperature, high humidity and a variety of different environments.Different types of ships have its own special requirements, therefore lamps for marine has more reliability and maintainability demanding compared with the lamps over land; LED lighting is a new energy-saving and environmental protection green light, and currently,the efficiency of electro-optical conversion of LED lights is very low,70%-80% of the energy converted to heat; power for engineering applications continues to improve, and the heat flux becomes larger, the junction temperature has a direct impact on the work and life of LED lights, LED lamps for marine due to its special environment. My study is using micro channel cooling fin structure better heat transfer to the lighting,to ensure that LED lights work properly and prolong the life of the important theoretical significance and economic value.Firstly, using the fluid dynamics software Flo EFD for NX for a high-power LED lighting of marine for thermal analysis, and use the test equipment for the LED temperature measurements of each node, verify that the software can meet the basic requirements of the described simulation. Then for each single factor to simplify the structure of the LED lamps finned radiator simulation analysis, when the ship ambient temperature is 25℃, the length of the fin is 20 mm, height 15 mm, thickness 2 mm, substrate thickness of 4 mm, fin The number is 20, the radiator cooling effect is best.Microchannel width of the theoretical values, using fluid dynamics software Flo EFD for NX, microchannel structure width, height, coolant inlet velocity simulation, analysis the affection of related factors channel cooling effect ion caused. Simulation results show that: Considering the effect of the flow channel width, height and area of the inlet flow rate of cooling, cooling liquid dynamic viscosity brought about by the flow channel width of 0.9 mm, a height of 1 mm, a flow rate of 1m/s when the optimum cooling effect. Finally, the combined of the Microchannel channel and fin-type structure, the chip junction temperature lower than that without thermal structure of 37.61 ℃, the heat dissipation of the microchannel fin structure has more advantages.