Fmea And Failure Control Method Of Pbga Application In Aviation Equipment

Today assembly and packaging is a limiting factor in both cost and performance for electronic systems. This is stimulating an acceleration of innovation. Design concepts, packaging architectures, materials, manufacturing processes and systems integration technologies are all changing rapidly. This accelerated pace of innovation has resulted in development of several new technologies and expansion and acceleration of others introduced in prior years. Wireless and mixed signal devices, bio-chips, optoelectronics, and MEMS are placing new requirements on packaging and assembly.This paper discusses the details of the defect phenomenon and the failure analysis, and also proposes the failure mechanism based on the materials characterization data. Based on this study, several methods and techniques are used to reduce the failure probability and sort out the potential failure risk ensure the quality of high reliability devices.