Suitable For High-performance Package Substrate Design And Research

The electronics industry over agriculture, the automotive industry and heavy industry became the largest industrial. Electronic parts industry is an important foundation for the electronics industry, particularly in microelectronics as the core technology. IC design, wafer manufacturing, packaging of microelectronics technology has become an integral part of the three organic.The packaging industry in our country has been great progress since 2000, We can build from the low-end DIP (Dual In-line Package), into a SOP (Small Outline Package), QFP (Plastic Quad Flat Package), PLCC (Plastic Leaded Chip Carrier), BGA (Ball Grid Array Package), LGA (Land Grid Array), FC (Flip Chip), such as surface mount package type. BGA, LGA, FLIP CHIP has become a mainstream category of high-end package.BGA, LGA, FC type is characterized by one same point, both of them need use substrate. We call it as the package of substrate type of package.China's IC industry is the focus of the current industry. Packaging industry as an important part of the integrated circuit industry has become one of the hallmarks of a national scientific and technological level. Substrate type of package is more advanced package, has been in China a certain degree of development, but with foreign countries, especially Japan, Korea, and Taiwan are still a certain gap.The paper is to look at the design of the current major considerations, and explore the design of specific ways to promote the design of the current theoretical studies of substrate and specific design standards.The paper introduced the whole package substrate in the role, types, production processes, packaging processes; discussed the choice of substrate materials; and Polar, Flotherm software simulation in order to achieve electric substrate with the requirements of the entire chip design matching; to the final substrate specific design, during the design process, combined with the current package of the process. We checked the overall requirements for verification using Ansoft link&spice link&Q3D.The paper explored the major consideration factors - materials, electric matching, matching technology, summarized the current major issues and possible solutions-the main material of the monopolistic industry, manufacturers need materials increasing investment in research and development. Packaging technology and the continuous development of plate-making process, the design must be based on the ability to design the current reality; show the substrate design methods - simulation design verification.