Preparation And Thermal Properties Of Phenolic Molding Compounds With High Temperature Resistance

Phenolic molding compound is the one of the widely used polymer materials for its products, which has the products forming fast, high yield, excellent product performance and other characteristics, as low prices, it has been the market's attention. But with the cars, cooking utensils and other industries widely used, and with more and more harsh working conditions such as high-speed, high pressure, high temperature, the high temperature characteristics of phenolic molding face new challenges, so domestic and foreign colleagues are exploring new phenolic molding compounds to meet the requirements of the new field. Few people at home and abroad have made the phenolic molding compound at different temperature range of performance evaluation.This article dedicated to the research the species phenolic molding compound which has practical value and can be industrial production, we simultaneously efforts to improve the heat resistance of the same product and ensure that other aspects of the basic properties of product to achieve the level of conventional varieties. Phenolic molding components are many and complex, between the different properties of materials containing role, and therefore improve phenolic molding compound's heat-resistant, while trying to find a reasonable formula corresponds to the performance of process equilibrium is the main purpose of the study.In this paper, we study the structure and thermal stability of the preparated phenolic molding compound, and analyzes some of the factors which impact the high temperature properties of phenolic molding compound. First, the influences of condensation reaction of different phenolic material ratio on heat resistance of phenolic resin were investigated. Based on different proportions of phenolic resin and polysulfone blends, compound curing agent, inorganic short glass fiber reinforced materials and other aspects of the interface modification technology to improve the performance of phenolic molding compound's high temperature modification. System mixed by a special plastic mixing, preparation of the high temperature phenolic molding compound and use of TG, the thermal deformation temperature, dip solder, thermal stability test were carried out in this kind of phenolic molding compound curing, exothermic behavior and TGA analysis, and perspective from heat-resistant of phenolic molding compound, the indicators identified by testing the most significant impact of blends, making the heat resistance of composite materials has been greatly improved for phenolic molding compound in higher temperatures in the field of applications possible.