Diamond Tool Wear And Length Of C-C Bond

In the nanometric cutting process, the wear of diamond tool will seriously affect thequality of the machined surface. From microcosmic angle, this thesis is studied thediamond wear because of the change of C-C bond length., and anlysised the role oftemperature in the cutting process by molecualr dynamics. Therefore, this essentiallyrecongnize the tool wear mechanism has an important theoretical significance, and it isimportant in the development of nano-processing technology.The cutting model of wear of diamond tool is established,and analyse the tooltemperature, the shear zone temperature, the forface of tool and the average potential oftool in the cutting process.It analyse the change of the the bond of C-C at the cutting edge, the flack face and themiddle tool in the cutting process, so that it explains the cause of the wear of diamond tool.It establish the cutting model of the constant temperature molecualr dynamics, anddetailed anlysis the effect of the temperature on the C-C bond length and the averagepotential of tool in the cutting process, so that further explain the role of the temperture inthe tool wear. At the same time, it analyse the cause of the different cutting thickness onthe different degree wear.By molecular dynamics simulation and visualization software VMD observed in thecutting process, it investigation the cause of the formation process of carbide.