Experimental Investigation On Thermal Contact Resistance Of Solid Interface Between Cu And AlN At Low Temperature

The thermal concact resistance of solid materrials interface widely exist among various engineering applications,such as spacecraft (satellites and spacecraft, etc.) thermal control technology, high-power integrated circuit chip thermal design,the cryocooler conduction cooling system of superconducting magnetic energy storage, cryogenic liquid storage and transportation equipment design, etc.. It is the key factor and difficult point for microstructur heat conduction,it is the urgent need to solve for the scientific problems. This project comes from the National Natural Science Foundation of China (50876034):Research on heat transfer characteristics of 3D microstructure solid-solid contact interface layer at low temperature based on photothermal method by laser.The investigation of this paper is the thermal contact resistance of solid interface between Cu and AlN at low temperature.The thermal contact resistance is affected by many factors,thermal properties of materials is the foundation to research the thermal contact resistance.Based on the method of laser photothermal research method,two stage G-M cryocooler as cold source, establish temperature measurement and control system at low temperature and vacuum conditions, measurement thermal diffusion coefficient of Cu and AlN at 50K ~ 300K temperature range,obtained experimental data,and the thermal contact resistance of solid interface between Cu and AlN at 0.20MPa ~ 0.57MPa pressure range, 70K ~ 300K temperature range.Based on experimental data, using the matlab software regression analysis and model simulation, to obtain the full quadratic prediction model of thermal contact resistance. Reveal the heat transport characteristics and mechanism of thermal contact sesistance at the micro level.Experimental research and simulation results show that the AlN thermal diffusion coefficient in 70K ~ 150K temperature range increase significantly, in 150K ~ 300K temperature range change slow,and the Cu thermal diffusion coefficient in 50K ~ 100K temperature range increase significantly, in 100K ~ 300K temperature range change slow.The thermal contact resistance of solid interface between Cu and AlN is affected by coupling effect of temperature and pressure.The temperature influence is bigger than pressure to thermal contact resistance. In the 70K ~ 300K temperature range ,thermal contact resistance decreases with increasing temperature, in the 0.20 MPa~ 0.57 MPa pressure range, thermal contact resistance decreases with increasing pressure.Because the thermal contact sesistance of solid material interface is very complex,it is a challenging scientific problems.It is very significant,not only in engineering application or scientific research.This requires more time and energy to further study.