Synthesis Of Tetraphenol Ethane Epoxy Resin And Its Property

Electronic materials are the basic of the microelectronic industry, as the mostly structural materials of integrated circuits—epoxy resin molding compounds are developing fast along with the development of the technology of chips. It is a stringent problem to be researched that how to researching and exploiting epoxy resin molding compounds with high properties and using domestic packages to replace import products.Tetraphenol Ethane Epoxy Resin (TGE) which is electronic encapsulation materials of the symmetric framework of high strength and toughness. It has not only the properties of common epoxy resin, but also has UV-block, fluorescence and AOI (Automatic Optic Inspection) properties and so on. It is little reported on the study of the product in home.In this paper, TGE was synthesized from epichlorohydrin and Tetraphenol Ethane (THPE). The structure of synthesized TGE was characterized and its optical property was measured. The results showed that the TGE with high epoxy value was obtained successfully by one step process when the reaction temperatures was 105℃, the time of adding NaOH was 3h, the concentration of NaOH was 30%, the holding time was 2h and epoxy value of resultant TGE reached 0.544 which is much higher than that reported in limited literatures and patents. The unique ultraviolet absorbance of TGE is 328nm and its fluorescent emission is a series bands at about 671nm and 700nm. The florescence intensity increased with increasing content of TGE in dilute solution and decreased with increasing content of TGE in concentrated solution. The fluorescence intensity increased with the increase of solvents'polarity. The ratio of bisphenol A epoxy resin (BPA) to TGE has little influence on the fluorescence intensity.In this paper, the viscosity-temperature curve and cure kinetics of TGE/BPA system were investigated, the thermal decomposition temperature and mechanical properties of cured compounds were investigated. The results showed that the viscosity was decreased with rising temperature and increased with increasing content of TGE. The curing activation energy was about 55-kJmol-1 estimated by Kissinger's approach while curing procedure was 50℃/2h+100℃/6h. The thermal decomposition temperature increased with increasing content of TGE. In D230 system, the maxima of tensile strength and elongation curve of TGE/BPA system were 65.96 MPa and 4.63% respectively when the content of TGE was 5%. In Triethylene tetramine system, the maxima of tensile strength and elongation curve of TGE/BPA system were 58.84 MPa and 3.45% respectively when the content of TGE was 2%. In Triethylene tetramine/BPA system, the maxima of tensile strength and elongation curve of TGE/BPA system were 56.91 MPa and 2.98% respectively when the content of TGE was 8% and 5%.