Copper And Its Oxide Films Prepared By Magnetron Sputtering, And The Catalytic Properties Of The Ap

Compared to the liquid method, which is widely used to prepare transition metals or transition metal oxides on the thermal decomposition of ammonium perchlorate (AP), Physical Vapor Deposition (eg.magnetron sputtering technology) has scarely been reported so far.In this paper, copper thin films were prepared form 99.99% high purity copper target by magnetron sputtering technology, and then calcined to CuxO(x=1,2) thin films. The structure, morphology and thickness of Cu thin films were characterized by X-ray diffraction (XRD), Raman spectrometer (Raman), Atomic force microscopy (AFM), Field emission scanning electron microscopy (FESEM) and Step devices, respectively. We discussed the substrate material, sputtering power, sputtering pressure, deposition time and calcining temperature on the effect of Cu films structure, morphology, grain size, ingredient and thickness. The results indicated that the substrate material influenced the crystal structure of Cu films; the deposition time not only affected the film coating thickness, but also the film microscopy structure was changed from spherical grains to octahedral grains; the sputtering pressure and the sputtering power exhibited the different film surface grain size, roughness and deposition rate; furthermore, the calcining temperature caused the difference film competition and surface roughness.Cu and CuxO(x=1,2) thin films with a certain proportion were mixed in the ammonium perchlorates. The different preparation condition, content and composition of Cu and CuxO(x=1,2) thin films on the AP thermal decomposition were studied via Differential scanning calorimeter (DSC). It was showed that the presence of copper films had obviously catalytic effect on the thermal decomposition of AP, decreased the best low and high temperature exothermic peaks to about 270℃and 350℃respectively, and increased the heat release of AP to 1212.98J·g-1 greatly compared with 563.74J·g-1 of pure AP. Addition of Cu thin films led to the low temperature stage exothermic peak of AP becoming steep significantly.In addition, Using Thermal gravity and Mass spectrometer (TG-MS), gaseous products of the high and low temperature decomposition stages of pure AP and adding Cu films to AP were measured separately, all including H2O, NH3, O2, NO and N2O; and the mechanism of AP thermal decomposition was studied preliminaryly.