Study On Temperature Field And Residual Stress Model Research Of MEMS Accelerometer

The accelerometer is an important inertial sensor. It has been widely applied in various fields such as inertial navigation, consumer electronics, automotive electronics and geological exploration which are concerned to the national economy and the people's livelihood. With the merits of high resolution, large dynamic range, and good temperature characteristics, the capacitive MEMS accelerometer has been extensively used.Based on the existing research results and the performance status of the MEMS accelerometer developed by our team, the exploration of the temperature as the main purpose of the devices studied and the improvement of device performance will be the focus of this study. And based on finite element parametric modeling of the temperature field and the coupling field analysis methods, we devoted to the establishment of MEMS accelerometer temperature field model and residual stress model, which have provided some theoretical and experimental basis for the establishment of the next accelerometer temperature compensation model and perfect temperature control system, and the revised design of the accelerometer.The major work of this thesis includes the following components.Chapter 1 mainly shows the Research background and part of the basic principles and monographs and literature summaries that have been published within the field of MEMS accelerometer. The development of MEMS accelerometer, research status, the key issues facing the group developed the basic principles of the MEMS accelerometer, the basic theory of the field of thermodynamics, and basic research methods based on finite element simulation served as foundation are introduced in this section either.In Chapter 2, the temperature field model of the MEMS accelerometer has been established, and the model error has been analyzed. It has been compared with experimental results to verify the correctness of the modeling approach and the rationality of the results. With the temperature field model, we optimize the result from adjusting the heat sources and adding the auxiliary radiator. In addition, the MEMS accelerometer thermostat temperature field model has been established, which provides guidance to the following perfect for the temperature control system.In Chapter 3, the anodic bonding residual stress model has been established. The law of temperature on the thermal stress has been obtained. The impact of structural adjustment on the thermal stress and the thermal stress on device performance have been analyzed.In Chapter 4, we execute a quantitative analysis on the effects of the process error on the device. Increasing in the annealing process, adjusting the temperature of the bonding and the use of step-by-step structure release and other process improvement suggestions has been proposed on the perspective of the mechanical structure and process.Chapter 5 has summarized the job that we have done in this paper, and our research" direction and future outlook are mentioned.