Study Of Characteristic Of Cu/Ni Multilayers Prepared By Multicomponent Arrayed Jet Electrodeposition

Multilayer materials as the third representative of the surface technology, have some specialperformance, which are not bulk material and any single-component films available. In the past20years, multilayers have become a very popular research topic in physics and materials science. Themanufacturing method of multilayers include physical methods, chemical methods andelectrochemical methods, which are all have their own limitations. This paper first propose a newtechnology called “multicomponent arrayed jet electrodeposition”, as a new process method formultilayer. This method is based on the local deposition characteristics of jet electrodeposition, thesingle jet unit is transited to a spatial jet units array. This technology is expected to handle the processcomplexity, costly equipment and other inconveniences in current multilayer film preparation method.This innovative work and the main research of the paper are as follows:(1) Design and build up the system of “multicomponent arrayed jet electrodeposition”, which isbased on the original jet electrodeposition equipment. Develop the "switch over control" automaticcontrol system, in order to realize the precise control and automation when the equipment working.(2) Making some Cu/Ni multilayer films under the condition of the various parameters. Thecross-section morphology, organization structure, and performance of the Cu/Ni multilayer areresearched and analyzed by means of scanning electron microscopy (SEM), X-ray diffraction (XRD),micro-hardness tester, ball disc wear and electrochemical corrosion. Found that the multilayersperpared by the new method have clear interface between sublayers, and the microhardness and wearresistance of nano-multilayers are higher than pure copper and nickel significantly. When themodulation wavelength reach the most excellent value, the Cu/Ni multilayer have the best corrosionresistance.(3) Study the influence of process parameters (including current density, nozzle size, etc) on thecopper/nickel multilayer modulation wavelength and the modulation ratio.(4) Study the influence of parameters (including modulation wavelength, copper sublayerthickness, etc) on the copper/nickel multilayer performance using the test results.