Preparation And Estimation Of Wear And Corrosion Resistance Superhydrophobic Surfaces By Electrodeposition

There is a serious defect of hierarchical micro-nanostructure on most superhydrophobic surface, the defect is that the mechanical properties of the micro-nanostructure surface is very weak. Because the surface’s structure is very fragile and damaged by mechanical effect which involves the effect of external force or external attrition, the surface’s superhydrophobicity often lose. This paper aims to solve the weak mechanical properties of superhydrophobic surface by taking advantage of electroplate film’s high hardness, high toughness and good adhesive.This paper is to find a method which can prepare hierarchical micro-nanostructures’ electrodeposition copper plating using CUSO4solution, then apply to the aluminum and stainless steel substrates.Firstly, we found the electrolyte solution formulae and process conditions to prepare micron copper grain film on copper plate by changing the electrodeposition requirement. The electrolyte solution formulae were CUSO40.5mol/L, Cl-ion0. The process conditions were electrode current density0.06A/cm2, solution temperature80℃, electrolyte solution’s pH2.00, deposition time60min. The surface cooper crystallizations gather to be many discrete spherical microparticles whose diameter are about10μm on deposition plating and there are some microgaps and microholes among the discrete microparticles. The microholes’maximum diameter is about10μm, and then form a micro-rough surface with discrete spherical microparticles. The process condition which is simple is friendly to the environment, because it does not need any additives and not produce any copper ion complex which is harmful to the environment.Secondly, the electrodeposition film was processed with three different methods at room temperature, then possessed superhydrophobicity after fluoroalkylsilane modification.①Some nano-squame structure appeared on electrodeposition plating surface after acidification treatment, and the water contact angle was up to158.1°after the prepared surface was modified using fluoroalkylsilane ethanol solution. The corrosion of the prepared superhydrophobic surface speeded up, because Cl-ion produced on the electrodeposition plating surface after acidification treatment.②A hierarchical structure of CuO microspheres and Cu(OH)2nanorods are fabricated on the plating immersed in potassium persulfate and sodium hydroxide solution for20min. The surface exhibited superhydrophobicity after fluoroalkylsilane ethanol solution modification and the water contact angle was158.3°. This surface possessed good corrosion resistance and its inhibition efficiency reached98.1%. But because the mechanical properties of the prepared hierarchical structure of CuO microspheres and Cu(OH)2nanorod is very weak, so that fingerprint was prone to print on the surface.③Nanopits appeared on the electrodeposition plating microspheres after immersed in copper ammonia solution for15min, then the surface exhibited superhydrophobicity after fluoroalkylsilane ethanol solution modification with water contact angle of156.6°. The tests showed that the superhydrophobic surface possessed good corrosion resistance and wear resistance, the corrosion inhibition efficiency reached87.3%and the surface hardness was4H measured with lead pencil.Finally, we prepared electrodeposition cooper plating on aluminum and stainless steel plates which were pretreated in advance. The surface possessed superhydrophobicity after immersed in copper ammonia solution for15min and fluoroalkylsilane modification. The tests showed that the superhydrophobic surfaces prepared in the paper possessed good wear and corrosion resistance and the maximum hardness of the prepared surface was4H.