Research On High-speed Milling Of Micro-PCB With TiN Coated Tool

Micro PCB is a new kind of composite which is applied in many industries, such as radar, satellitecommunications and automobile et al. However, there are few studies on the mechanism of it especiallyhigh-speed milling. During producing process workers have been troubled by a lot of problems such aslarge cutting force, high temperature and serious tool wear. The technology of High-speed milling ofmicro PCB will be studied in this paper to solve the problems which were concerned.Single factor and orthogonal experiments that compared the variation of the cutting force with thechange of cutting parameters were carried out to provide a basis for the chosen of milling amount.Models of cutting force and the coefficient of cutting force were created. Their reliability wasconfirmed by the performance test. ABAQUS was used to simulate the deformation and stressdistribution of tool.Cutting temperature is another important factor in milling micro PCB because of the low thermalconductivity and low melting point of the media layer. It relates not only the tool wear but also themachining quality. ANSYS was used to calculate the distribution rates of cutting temperature bytheoretical formula. The temperature field was simulated to find the change regularity of cuttingtemperature with variation of parameters. This regularity was in agreement with cutting force.Single factor experiments were done to study the influences of cutting parameters on the tool wear.VB namely wear quantity of flank was used as the standard in measurement. Microstructure wasobserved by SEM in this paper finding that the main wear mechanisms were abrasive wear, adhesionand diffusion.