Preparation And Characterization Of Aluminum Boron Silicate Vitrified Bond And Lead Glass Inorganic Binder

In this paper, aluminum boron silicate vitrified bond used in ceramic abrasive preparation was synthesized through a traditional method. The binding interface between vitrified bond and microcrystal alumina ceramic was analyzed. Moreover, the effects of different components and their ratio on the performance of vitrified bond were studied. And lead glass inorganic binder used in the preparation of silver paste was prepared. The inorganic binder property, combination with Si wafer and the influence of different ratio on the melting temperature of inorganic binder were also discussed.1. Aluminum boron silicate vitrified bond for ceramic abrasive toolsAluminum boron silicate vitrified bond was prepared through traditional method with γ-Al2O3and ZnO nanoparticles as raw materials. Raw materials were melted after being mixed uniformly, and then quenched, dried, ball milled and sieved, and finally the product was obtained. The vitrified bond and strips were characterized by XRD, SEM, IR, TG-DSC and EDS mapping, and the effect of different components and ratio on the melting temperature and strength was studied. The results showed that the completely melting temperature of vitrified bond increase and bending strength of strips decreased with the increase of Al2O3/B2O3mole ratio. And the completely melting temperature of vitrified bond increased with the increase of SiO2/B2O3ratio, but without obvious change in the bending strength of strips. The bond exhibited typical glass phase with low melting temperature and high bending strength of strips (53.62-93.34MPa). The microstructure analysis indicated the enhancement of the bonding strength resulted from the chemical reaction between the vitrified bond and microcrystal alumina ceramic. 2. Lead glass inorganic binder for silver pasteA series of lead system glass binders were prepared by mixing PbO, SiO2, B2O3, Al2O3, ZnO and Bi2O3in different proportion. The product was characterized by XRD, TEM, IR and TG-DSC. The relation between milling time and the size of particles and the influence of composition and additives on melting temperature of binder were also discussed. The introduction of Bi2O3had little influence on glass complete melting temperature. The complete melting temperature of glass power decreased with the increase of ZnO/SiO2mole ratio, but increased gradually as PbO/B2O3mole ratio decreased. In addition, the combination of products and silicon wafer were also analyzed, indicating that at a certain sintering temperature, the complete melting temperature of glass power should be in a certain range. When the complete melting temperature is low, silicon wafer will be etched excessively. When the one was too high, glass power would not react with wafer, resulting in no conductive function.