| Epoxy resins, an important thermosetting material with excellent adhesion to many substrates, have been widely used as the adhesive in the semiconductor devices. However, epoxy resins suffer many drawbacks, such as low impact strength and large shrinkage during crosslinking. In this paper, the incorporation of an acrylic rubber (ACM) and inorganic fillers (nanoclay and nanosilica) have been used to modify the physical properties of epoxy adhesive (EP) for the first time. The effects of crosslinking condition and nanofillers on the morphology and properties of the EP/ACM blends have been investigated systematically. It was found that the reaction induced phase separation (RIPS) takes place for the EP/ACM=80/20and50/50systems, while other blend systems maintain the homogeneous structure during the crosslinking process. It was further found that the phase separation by the crosslinking leads to the EP-rich dispersed phase and ACM-rich matrix phase for the blend by TEM, indicating the each other inclusion structures for the RIPS systems. The phase structures and physical properties of the EP/ACM blends are much dependent on the crosslinking conditions, which provide feasible access for manipulating structures and properties of the EP/ACM blends. Furthermore, the morphologies and properties of different nanocomposites di-bond film composed by an acrylic rubber matrix, epoxy particles and inorganic MMT/nanosilica were studied in the work by direct solvent blending. For EP/ACM/nanofiller, catalysis action on the phase separation of EP/ACM blends and appropriate distribution of the nanofillers were thought to facilitate the moderate increments of storage modulus and limited toughness effect. T-peel mechanically treated testers were proposed to delicate the adhesive properties of the EP/ACM/nanofiller di-bond films. The effects of the thickness, morphologies and the interaction between the substrate of the modified epoxy based di-bond films were discussed in the work. |
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