Research Of Film Uniformity On Small Target And Large Substrate By Magnetron Sputtering With Multi-workbench

Magnetron Sputtering has been developed as one of the most important technologies in industrial coating,especially for the area of large deposition. And the film uniformity as well as deposition rate are the key of magnetron sputtering technique,corresponding small target large substrate coating to address these issues needle,including the workpiece from the work place,physical forms and the target width of etching,to discovery the method rule of guaranteing the utilization target and improving the film uniformity.This paper has presented a new type of multi-site magnetron sputtering system,which has more than one workbench,not only with rotation and revolution but also having different target-substrate distance and eccentricity.Based on the operating principle of the magnetron sputtering system with a circular plane target whose surface area is smaller than that of substrate,a mathematical model was developed to simulate and discuss the influencing factors on the film thickness uniformity.The results showed that when the substrates are rotating axially and eccentrically,the target-substrate distance and eccentricity both affect the film thickness distrbution.If the eccentricity is constant,the film thickness becomes thinner with increasing target-substrate distance,and the thickness uniformity tends to be improved.If the target-substrate distance is constant,the thickness uniformity becomes better then worse with increasing eccentricity.Moreover,if the substrate rotates axially and revolves round the target simultaneously,the thickness uniformity becomes better with increasing velocity ratio of axial rotation to revolution,and the effect of the thickness unifomity becomes smaller gradually if the ratio increases to a certain degree. In addition, increasing etching area properly can be also conducive to better film distribution,improve the substrate film thickness uniformity.Finally, taking a related experiment and analysising of experimental data, basically consistent with the conclusion of the study results.By analyzing the law of the small-target magnetron sputtering large substrate thickness uniformity, with the new type of multi-site magnetron sputtering system, and demonstration experiments, conducive to obtain good films on large substrate.The rules as above provide theoretically a reference for the design of a magnetron sputtering system which has more than one workbench with small target to large substrate and its applications.