Study On The Complex Of Epoxy Resin/Elastomeric Polymer

Epoxy resin is a kind of adhesive with excellent properties, such as high bonding strength, low volume shrinkage ratio, chemical resistance, and Easily formulated, simple of manufacture technique, wide in range of application, low toxicity, non-environmental pollution. It has excellent adhesive power to many materials, such as metal, plastic, wood, ceramic, glass, composite materials, concrete, rubber, fabric, etc. However, because of the low molecular type of three-dimensional mesh structure, most of the available cured bis phenol A epoxy resin t is brittle, Intolerance to shock and vibration, easy to crack and. When using the high viscosity of bis phenol A type epoxy resin and the high viscosity polyamide curing systems, the toughness of the cured product would be improved, but it is difficult to industrialization in the composites industry. Therefore, the research of low viscosity curing system which has the same property with the high viscosity commercial bis phenol A epoxy resin curing system has become one of the hottest research topics. When used as structural adhesive, the toughening modification of epoxy resin is necessary, and greatly reduced the viscosity of the epoxy resin curing system and improve the heat resistance has important significance.A kind of two-component epoxy resin curing system was prepared by the blending of Silicone, epoxy E51, curing agent802. The gelation time and mechanical properties of the resin in different proportions of epoxy resin was studied, and the mechanical properties of the resin doped with nano SiO2and WS-12particles was evaluated. The results showed that, when m (Epoxy E51):m (TEOS)=30:70, m (SiO2)=4%, m (WS-12)=2%, the mechanical properties and physical properties of the cured resin is the best. TG analysis showed that the thermal properties of the epoxy resin was improved by blending with the silicone.A kind of reactive polyurethane endblocked with isocyanato group was synthesized by the reaction of a copolymer of PEG-PPG and MDI. The curing system with low viscosity was produced when epoxy resin6002mixed with the reactive polyurethane in the presence of catalyst XCT-cat57and curing accelerator XCT-cat37. The adhesiveness of the blend resin with low viscosity was investigated and the adhesion strength of the cured blend resin was evaluated by experiment. The mechanical properties of the cured resin is the best when m(Epoxy6002):m(reactive polyurethane).50:50.