The Prepare And The Performance Research Of Epoxy Resin Bond Diamond Whetstone

Due to the high efficiency, low energy consumption and high-quality, diamondwhetstone is gradually replacing the ordinary silicon carbide whetstone in the surfaceprocessing field of ceramics and stone materials. Because of the good self-sharpening,high grinding efficiency and fine surface finish during the grinding process,resin-bond diamond whetstone is widely applied in the surface polishing of materials.In this paper, the resin bond diamond whetstone was prepared by the method ofcasting, and the whetstone’s preparation process and properties were studied.Based on the requirement of the preparation and performance, the liquid epoxyresin, diamond grit and filling were used to the preparation of the resin bond diamondwhetstone by the method of casting. We designed three groups of formulas and someof the materials were processed in advance. By testing the viscosity of the resin atdifferent temperatures and filler during the mixing process, it was found that theviscosity of the resin was minimum at80℃, which was the best condition of themixing process. The nano-SiO2has a greater impact on the viscosity of the epoxyresin slurry than CaCO3. So, we can adjust the viscosity of casting slurry by changingthe content of these two substances. The analysis of the effect of nano-SiO2on thestability of slurry showed that when the content of epoxy resin is26%and the contentof nano-SiO2is4%, the stability of slurry is the best. According to the gel time of theepoxy resin system with different content of the accelerant, it is finally determinedthat the optimum content of accelerant is0.25%. Combining with the analysis of DSCand FTIR as well as casting process, the curing process was decided, which was130℃/4h+160℃/2h.Via analyzing the effect of preparation process on the performance of thewhetstone, it was found that the whetstone has the relative least pores, the maximalintensity and hardness, when the casting slurry was treated under the vacuum of0.02MPa. After being modified by the silane KH570, the nano-SiO2particles have thehigher dispensability in the diamond whetstone, and the preparation process ofdiamond whetstone is optimized. Through the analysis of the fillings on theperformance of diamond whetstone, we found that when the content of nano-SiO2,CaCO3and copper were4%,3%,5%, respectively, the intensity, hardness,heat-resisting and wear-resisting of the whetstone were the best. So the best formula of the whetstone was determined. By comparing the grinding performance of thewhetstones prepared by three different diamond abrasives based on the best formula,we found that the grinding performance of whetstone prepared by the KH570-RVDand Ni-RVD diamonds were increased14.9%and32.8%in the comparison with thewhetstone prepared by the RVD diamonds.