Research On Dynamic Simulation Technology Of Grinding System In Large-size Silicon Ultra-precision Grinding Machine

Integrated circuits are the foundation of modern information industry and informationsociety, more than90percent of the global IC uses wafer as substrate. With the rapiddevelopment of integrated circuit manufacturing technology, in order to increase theproduction of wafer, reduce unit manufacturing costs, wafer tends to large size. With theincreases of wafer size, in order to ensure the strength of wafer, the thickness of wafer need tobe increased; in contrast, in order to meet the requirements of advanced integrated circuit chippackaging technology, the thickness of wafer need to be reduced. These changes in waferprocessing technology face many outstanding problems. In order to solve these problems, theconsolidation grinding wheels ultra-precision grinding technology is to replace the traditionalgrinding technology to become mainstream development direction of the waferultra-precision planarization processing technology. In this paper we consider diameter of300mm wafer ultra-precision Grinding System as object, research its dynamic simulation andmotion analysis, which has very important significance to improve China’s large-size waferprocessing technology. In this paper we carried out the following work:First of all, introduce the important role of wafer in electronic information technology,compared traditional wafer grinding technology and modern wafer grinding technology, andlist several commonly used grinding methods in wafer and large-size wafer ultra-precisiongrinding machines, paving the way for the launching of the subject.What’s more, study large-size wafer ultra-precision grinding machine which based onwafer self-rotating grinding principle, discusses the grinding principle and the establishmentmathematical model, which provides a theoretical basis for the later movement analysis;analysis the structure of the grinding system and the movement of coarse grinding spindle,fine grinding spindle, indexing table and working table in the main grinding system and theworking principle of precise positioning system, grinding force measurement system, waferthickness measurement systems, face control systems, and adhesive force measurementsystem of suction cups in auxiliary grinding system.Third, consider asynchronous mode secondary development of Pro/E,3D graphicstransformation, frame by frame animation as key technology, three-dimensional model of thegrinding system as foundation, developing a virtual prototype of the grinding system,achieving the movement of the grinding system by operating the control panel, realizing theadjustment of the grinding speed and dynamics simulation of grinding system.Finally, analysis the motion of the key process of the feed system in the grinding system,getting the motion parameters of critical processes; research the factors which affect thetrajectory on wafer of grinding wheel and get a conclusion: the trajectory relates to the speed ratio of grinding spindle and wafer, has nothing to do with the rotational speed of the grindingspindle and wafer; study the parameters which affect the surface of the wafer and get aconclusion: the surface of wafer impacted by the angle of grinding spindle feed direction andthe wafer rotation centerline greatly, less affected by the grinding spindle speed, feed speed ofwheel and wafer, by which way can adjust the angle to control the surface of wafer.