Research Of Polishing Ceramic Roller Based On Magnetorheological-Ultrasonic Compound Technology

With the rapid development of high speed precision machinery, the speed andworking temperature of cylindrical roller bearings is higher and higher, so theapplication of ceramic roller bearing with low slipping rate and high workingtemperature has become a trend. As the core piece of ceramic roller bearing, there hasn’tfinded out an appropriate ultra precision machining method for ceramic roller.According to the characteristics of ceramic roller material and present situation ofspecial processing development, this paper adopted the method of magneto-rheologicalultrasonic compound polishing technology to process ceramic roller with high precision,the method is comprised of fluid dynamics, acoustics, electromagnetics, chemistry,mechanics and other multidisciplinary comprehensive application, and its advantage ishigh processing efficiency and easy control of processing surface quality, etc. Theresearch contents of this paper are as follows:1．MR fluid that can be applied in polishing of ceramic parts is researched. Basedof analyzing the property of MR fluid and the influence of the constituent to thepolished ceramic surface, the components of the MR fluid are determined. And thepreparation of oil-based magnetorheological fluid is used in the polishing of ceramicroller, It is shown that the MR fluid that is suitable for finishing of ceramic rollets.2．According to the characteristics of the ceramic roller magnetorheologicalultrasonic composite polishing techniques, developed the experimental setup ofmagneto-rheological composite ultrasonic polishing, according to the needs of thepositioning and polishing of ceramic roller, the roller needs to reciprocating motionback and forth on the guide roll, and demands a change to theno impact on the processof the ultrasonic device, the other mechanical device. This article focuses on theacceleration and deceleration algorithm ultrasound device and the experimental devicein the control system model.3．the material removal characteristics is studied in MCU finishing. It is shown that the removal in MCU is not due to normal loading of the abrasive but the shearstress. Deduced from the hydrodynamic lubrication theory, the material model of MCUis established. Then Preston’s equation is applied in the process of polishing, expatiatedforced workpiece three powers in the process of Mcu finishing.4．Several kinds of main processing parameter study is finished contraposedeveloped MCU finishing equipment. Those parameters include intensity of magneticfield, the density of polishing abrasive,polishing tool, ultrasonic amplitude and the gapbetween glass part and polishing tool. By the use of orthogonal experiment, theinfluence to the removal efficiency and the surface quality bu those parameters isanalyzed. The principle of the optimized parameters selecting is deduced.