Research On Cathodic Electrodeposition Of Titania Thin Film And Doping Elements

Electroplating is one of the most useful technologies in metallic and non-metallic film formation with advantage of low cost, simple operation, economical efficiency. Therefore, it is widely applied in the industry. However, it is limited by many factors resulting in defections on surface quality. On the other hand, the depositional mechanism of it is not dug enough leading to, to some extent, less its less industrial application. Hence, it is necessary to investigate on the effect of electroplating process factors on the final quality of work piece.In this paper, with forming the TiO2thin film in two-electrode system, the mechanism of cathodic electrodeposition is studied, specifically, on the influence of processing factors on morphology. In the experiments, it is found out that the formation and expansion of the cracks root from the gas produced in the cathode and the over thick film. More gas will generated once the depositing voltage increase, which also increase the deposition speed resulting in cracks. In addition, the longer the process goes and higher the concentration is, the higher the thickness of the film is. So the stress of the film that finally makes more cracks。With the variation of deposition voltage, deposition time, the PH value of solution and the concentration of composition, it is observed that the thin film made with difference parameters differs from each other. With the help of SEM, it is noted that the morphology of the film can be generally classified into three main types, pyknomorphic one, foraminate one and one with cracks respectively. It is proposed what determines the quality. It is noted that the grid size increase with the voltages goes up whereas it is reduced with the reduction of depositing time and concentration of Titanium sulfate. And there is nearly no co relationship between grid size and the PH value is observed.Moreover, it is proposed to develop TiO2with Fe with the method of cathodic electroplating. The thin film composing of different amount of Fe can be obtained through varying the concentration of Fe3+in solution. Via the XPS analysis, it is researched how the concentration of Fe3+contributes to the amount of Fe in thin TiO2film. And it is found out that the amount of Fe increases with the Fe3+concentration increasing with the range of0-4mmol/L. under SEM, it is observed that the grid size of the film with Fe is smaller than those of the film without Fe. However, the diameter of the grid increases with the increase on the Fe amount.