Research On Solder Paste Measurement Instrument

SMT (Surface Mounting Technology) mount quality is largely dependent on thequality of solder paste printing, solder paste printing quality will directly affect thecomponents of the welding quality. For example, the solder paste thickness is thin,will lead to the part pins and PCB (Printed Circle Board) board access is not strongenough, there may be tin less weld strength is not enough, thus affecting the reliabilityof the subsequent use of the process; if tin paste thickness serious thin, it will lead toair welding, likely to cause the parts mounting pin between the short circuit, and thusfunctional. Therefore, SMT factory will solder paste thickness test as the essential testof the SMT process.The purpose of the test Paste: A solid welding components, reliability test belowstandard. B, prevention thickness is mainly false welding, air welding phenomenon.The thickness of the solder paste is an important indicator to determine the solderjoint quality and reliability. In recent years, the density of microelectronic packagingis increasing welding pin spacing is getting smaller and smaller, the increasingly highdemand for SMT to achieve a small spacing, welding, and to ensure the reliability ofsolder joints, one important the part of the monitoring of solder paste printing quality,so to ensure that the solder paste measuring instrument accurate or not, it isparticularly important. However Paste gage performance and accuracy, you need tocycle testing and calibration. Therefore, the standard steps of the Paste gagecalibration and measurement standard. But now, our home does not have a maturetechnology means to calibrate the accuracy of such instruments, this paper set thestandard for calibration Paste gage step to develop a calibration method and means ofits measurement results uncertainty assessment.This thesis focuses on the above two problems, carry out specific tasks asfollows:(1) Analysis Paste gage the performance index, and its practical application inthe field of SMT, a series of performance parameters, the calibration parameters arelisted according to their degree of importance, and combined with the definition ofeach parameter andthe level of an existing instrument of their respective test andcalibration methods, on this basis, paste gage calibration method.(2) According to the indicators and characteristics of the solder paste thickness gauge, design and preparation of the steps of the standard used to calibrate the Pastegage blocks, it is by a group with different step height standard steps of blocks, thepaper analyzes the calibration standard steps, the level of accuracy, the error ofindication, showing the value of volatility, surface roughness, measurement of surfaceflatness and other technical indicators, and complete the assignment experiment.(3) The steps of the use of home-made standard on the Paste gage calibration,uncertainty analysis of measurement results. Research and experimental results provePaste gage calibration method of measurement parameters to meet the Paste gagedaily calibration and weekly inspection requirements; design Paste gage calibrationstandard steps to meet the instrument parameter calibration needs.