On Finite Element Modeling Technologies And Dynamic Analysis Of The Airborne Electronic Equipment

With the rapid development of the electronics industry, electronic equipment havebeen widely used in various industries, and bring ever-greater economic and socialbenefits. However, under real working environment, electronic equipment would beaffected by various kinds of mechanical force inevitably, especially vibration and shock,which may cause great damage. In order to improve the reliability of airborneelectronics equipment, the comprehensive structure dynamic analyses of them arenecessary.Firstly, this paper studies the model transformation technique between CAD andCAE. On this basis, the characteristics of Pro/E-Workbench data interface are analyzed,and then the distortion problem in model transformation process is researched deeply,the reasons of the problem and the solutions to it are presented.Secondly, the emphasis is put on the key techniques in the finite element moldingfor electronic equipments. This paper studies the method to built PCB model and thefinite element models of module level equipments are established by combining thedetailed modeling and mass equivalent methods. The characters of PCB boundaryconditions under different fixed situations and their realization in finite elementsoftware are analyzed in detail. An equivalent method is proposed to simulate the hingejoint of the front locking device whose feasibility and rationality are proved by anexample. The influences of the mesh numbers on calculation results are discussed;meantime, the finite element mesh size criteria are studied by an example.Finally, on the base of structure dynamic theory, modal analysis, impact responseanalysis and random vibration analysis of the structure are conducted using ANSYSWorkbench. By analyzing the response results, the rationality of modeling and accuracyof analysis are confirmed.