Study On Stability Of Laminated Chip Inductor

Along with the development of information technology, the digitized degree ofelectronic circuit is getting higer and higher, and inductors are being used wider andwider nowadays. With the development of the inductor, the produce and use ofmultilayer chip inductors are becoming widely. According to statistics, the used amounthas increased several times. Because of rapid development of design technology and thematurity of the LTCC technology, multilayer chip inductor has been wildy used. Alongwith the integration of system has become extremely large scale, the development ofelectronic system has be apt to higher frequency and lower voltage. The laminated chipinductors need higher reliability, which provides higher standard and challenge to theprocess, design, material of inductor.Multilayer chip inductor is a new type of inductor. The process for inductorproduction as follows: millingâ†'formingâ†'cuttingâ†'sintering latexâ†'silveringâ†'end processingâ†'test separator. In order to improve the stability of the product,reliability design is essential for production process. We should select the optimalprocess route, get rid of the factors affecting their reliability, and choose the mostappropriate test and installation method.This paper focuses on the investigation of stability of multilayer chip inductors, andstudy on optimization of inductor fabrication process, such as production process,strcture and material.1, Stability analysis of multilayer chip inductor;2, Exploratory study for the production process;3, Improvement of ferrite materials performance;4, Low temperature sintering for ferrite materials and nonmagnetic substance.Base on these works, we successfully achieved multilayer chip inductor samples,whose stability have been improved significantly.