Simulation Analysis And Optimization Of The High Speed Connector

In recent years, signal integrity problems of high speed digital transmission system has raised great concerns, and high speed connector has been the focal points as an important part of the system. Because of high transmission rate and high density of the signal, signal integrity problems of the high-speed connector became increasingly serious. Based on the signal integrity theory and electromagnetic simulation, this paper made a research on some important signal integrity problems including signal reflection, crosstalk and attenuation problem of the high speed connector, and finally achieved optimization design of the high peed connector.Firstly, the paper studied the signal reflection of the high speed connector. Combined with the theories of differential characteristic impedance and the impedance discontinuities, the paper aimed at the different bending structure and abrupt change of cross-section of the transmission paths, which caused the reflection in high speed connector. And it obtained a result which effectively reduced the signal reflection by optimized design and simulation analysis.Secondly, signal crosstalk of the high speed connector was investigated in the paper. As a result of the large number and high density of the transmission paths, signal crosstalk has been the most serious problem of high speed connector. According to the theories of crosstalk and mixed mode S parameter, this paper completed the analysis and simulation of crosstalk in different structure and dielectric, and the maximum crosstalk was introduced after that. Beyond that, this paper studied several effective electromagnetic shield structures, and completed the optimization design through simulation analysis.At last, the signal attenuation problem of high speed connector was also analyzed in this paper. Focusing on the skin effect and dielectric loss, this paper completed the simulation analysis and studied signal attenuation in different structures of the transmission paths and different dielectric of the connectors.