99% Alumina Ceramic Substrate Formation Of Modification

The99alumina ceramic substrate are widely applied in thick-thin film integrated circuit and the hybrid microwave integrated circuits, it has excellent insulation, heat conductivity, and dielectric properties, and so on. At the same time, It’s density, smoothness higher, less microdefects, and can be used for low-end film circuit after polishing treatment. But even after precise polishing, substrate microdefects still exist, these holes and defects greatly limits the application of the alumina ceramic substrate as the film-substrate. Therefore, a new and low cost substrate planarization technology that to achieve super smoothness substrate modification will be play a very big role in promoting the development of the thin film circuit.In this paper high-temperature glass glaze preparation and99alumina ceramic substrate modification was studied. According to theoretical calculations, the glass enamel composition on the performance of glass was studied, designed and adjusted a new high temperature glaze composition. The glaze was prepared at1450℃by melting method, its minimum softening temperature is higher than1100℃, also has a good high-temperature mobility. XRD analysis showed that the glass frit to take the high temperature water quenching can effectively avoid the natural cooling crystallization phenomenon.Prepared glass glaze slurry that was suit for the screen printing requirements, and studied the content of ethyl cellulose (EC) on screen printing paste viscosity. The viscosity of glaze slip is decreasing, and then increasing with the addition of EC, and the glaze slip is well suspended with0.3wt%EC at a long time.High performance glass glaze coating was prepared on99%alumina ceramic substrate with screen printing method, summed up a set of99%alumina ceramic substrate modification process, and the existing process is improved. Studied the influence of the sintering mode on the quality of the glazed modified substrate, and the best sintering model was obtained combined TG-DSC analysis. To ensure the best process conditions, smooth, uniform and flat glass glaze coating without any surface defect can be made in the range of2inches substrate through screen printing method. The modified substrate can achieve a balanced formation, no peak and valley difference, the P-V is less than8nm, the RMS is reduced to0.5475nm from3μm. The modified substrate is fully appropriate for the thin-film device/circuit requirements, and played a certain role in the promotion on99%alumina ceramic substrate applications.