Microwave Ltcc Vertical Hole Interconnect Modeling Research

LTCC (Low Temperature Co-fired Ceramic) is in the core place of multi-chip module (MCM) technology. With the excellent RF performance, LTCC technology becomes a hot spot in recent research on the high-speed high-density and three-dimensional integration technology. It is widely applied in radar communication systems. LTCC multilayer circuit strctures require the interconnection of signals between different layers which will restrict the overal performance of the circuit systems. This is of key importance in the design of LTCC circuit systems. This thesis mainly researches the vertical through-hole interconnection structures between three kinds of transmission lines in different layers and the modeling of these structures.Firstly, This thesis analyzes loss of three kinds of transmission lines and their propagation characteristics. They are microstrip line, stripline and coplanar waveguide. Suggestions on how to improve the design of LTCC circuit systems are proposed from the perspective of loss. Besides, based on the parity forbidden principle of electrmagnetic wave propagation, mode conversion of the verticl through-hole that connects three transmission lines are analyzed in detail. According to the standard process specifications of LTCC technology, general models which contain microwavestripline to microwavestripline, microstripline to stripline, microwave to cpw, stripline to stripline, stripline to cpw, cpw to cpw these6transitions in total. These models are frabricated and tested. Testing of these fabricated structures can verify the feasibility of the model.In this thesis, multi-dimensional Cauchy interpolation technique is introduced into the modeling of vertical through-hole structure of coplanar waveguide which has three substrate layers. By solving the linear programming, parameters of the multi-dimensional Cauchy rational polynomial can be found and Cauchy modes can be constructed. These complete the LTCC passive circuit model library.