Investigation On Microwave Vertical Assembly Technology

The microwave vertical assembly technology means that three dimensional (3D) high density microwave circuit system are manufactured by vertical interconnection utilizing the bottom and side edge of planar circuits. The microwave vertical assembly technology is the excellent method for realizing miniature volume, light weight, high performance and reliability of air-borne and satellite-borne electronic equipments. The microwave vertical assembly technology based on LTCC has become one of the hotspots in microwave circuit and system research field.In this dissertation, the research of microwave vertical interconnection and cubic assembly technology were developed which led to the breakthrough of conventional planar microwave circuit system. Three-dimensional T/R module was developed successfully which can be applied in the new generation air- borne multi-function phased array Radar. The contributions are summarized as follows:Firstly, on the research of 3D microwave interconnecting substrate, a new type of 3D interconnecting substrate with multiplayer microwave transmission line and passive components embedded is designed. The designing, emulating and testing of microwave vertical interconnection are completed.Secondly, the research of microwave vertical interconnection assembly technology was completed by using eutectic soldering, glue connecting and wire bonding methods. The soldering structure and the control of vertical interconnection were also discussed.Thirdly, on the research of packaging material, packaging thermal designing and optimizing, the packaging of three dimensional microwave circuits.Finally, the application of infrared thermography technology to microwave cubic module was discussed. Especially, the thermal design of microwave high power amplifier chip, the control of over-heated point for modulation chips and diagnostic technique of small signal amplifier chip were described.The 3D integrated T/R module is tested. It is showed that the T/R module is stable and satisfies the design requirements.