| With the rapid development of the mobile communication technology and micro projector technology, the micro projector is expected to be a new and standard configuration in the mobile devices after the camera, to meet the requirements of customers sharing the information display with others. The market of the micro projector has great potential. But, its serious energy consumption and heat dissipation would have restricted its development in the application of mobile devices.In order to solve the problems, this paper selected the built-in DLP micro projector produced by Texas instruments to do some thermal analysis. Based on the thermal model in the steady state, some cooling structures were designed, to improve the reliability of the micro projector in the design stage. This project comes from UESTC-NOKIA international cooperation.The main studies are as follows:1. Study the work principle of the micro projector and its internal structures, determine the main heat sources are LEDs and DMD components.2. Detail the heat flow path of the LED package and DMD components. Get two equivalent modeling methods to simplify the thermal model, named thermal resistance method and lumped parameter. Make the model of the green LED array in the steady state, compare the junction temperature by the thermal simulation with the value calculated by thermal resistance, to verify that the simulation is right.3. Simplify the structure of the built-in micro projector, and then make its thermal mode in the steady state, get the temperature distribution by the parameters set and grid partition. Design and finish the thermal test, measuring the temperature test points with thermocouples. Compared the measured value with the value of the model simulation to calculate the error, and analyze the causes of errors.4. Add some reasonable heat sink and some simple cooling optimization, which can effectively reduce the junction temperature of LEDs, and also reduce the temperature difference of the shell. |
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