Thermal Design And Simulation On Sealed Electronic Equipment

Along with the rapid development of electronic technology,especially since the emergence of semiconductor technology,high-power integrated electronic components have been widely applied in electronic equipment,because of which the heat flow density rises drastically and the temperature also increases.High temperature which is one of the major reason for the failure of electronic components and equipment has severely impacted the reliability of electronic system.The electronic equipment that works in the hostile environment usually relies on enclosed structure,as a result of which more severe influence is exercised on this kind of equipment.In the face of this problem,reasonable and effective thermal design for the electronic equipment has become the key to ensuring the normal operation of the electronic equipment.Therefore,it is of particular significance to making thermal analysis on electronic equipment and researching thermal design technology.Thermal analysis as well as thermal design technology has been researched and analyzed in this paper.Besides the common thermal analysis methods and heat dissipation means,the basic theories of thermal analysis are also researched.Meanwhile,thermal analysis and design have been conducted for an enclosed-type electronic device to propose the simulation analysis on the specific heat dissipation scheme.Studies have been presented on the working conditions and thermal design requirements of electronic equipment,analyzing the major heating components,and computing its dissipation power in this paper.In addition to the simulation analysis on the initial model of the whole machine,analysis on the heat source of the whole machine and the thermoelectric simulation network is conducted.According to the analysis result,the heat pipe radiator and heat conducting plate are installed for the major heating components,and the forced-air cooling plate is used for the heat dissipation of the whole machine.The mathematical model of fin heat transfer is built and derived,and besides,attention is paid to conducting numerical simulation for fin heat transfer process,analyzing the influence of fin size on heat dissipation,and designing the optimal CPU finned radiator in combination with the optimization module in the professional thermal analysis software Flotherm.Energy is devoted to researching the principle of heat pipe cooling as well as to designing heat pipe radiator and implementing simulation analysis.Attention is paid not only to researching forced-air cooling plate,and designing and computing the size of forced-air cooling plate,but also to selecting fan type and model and performing simulation analysis on forced-air cooling plate.Efforts are devoted to designing heat conducting plate for DSP chip,MOS pipe and rectifier for the sake of heat dissipation,conducting calculation for the heat conducting plate,and verifying the heat conducting plate by way of simulation analysis.Simulation analysis is conducted on the whole case in order to figure out the feasibility of heat dissipation scheme.