Disquisition Of How To Enhance The Peel Strength In Module Bonding With ACF

The turn of the21st century, TFT-LCD industry has gone from Japan,South Korea to Taiwan, the mainland’s development transfer, along withlower costs, improved technology, with a light, slim to become the mostpopular flat-panel displays.To achieve light, slim, means that the system integration need toupgrade to require IC pin become ever smaller and increasingly highprecision bonding. By welding has been no way to satisfy thehigh-precision IC bonding. The ACF (anisotropic conductive films), inChinese known as the anisotropic conductive adhesive, as a connectingmaterial that can correspond to the electrode pitch is small, fineelectrodes can be easily achieved in the upper and lower leads, are widelyused in liquid crystal module bonding and a variety of electronic productsmodules packages.Application of ACF bonding process, the connection of the solid ornot, the reliability of the results of bonding has an important impact. Weuse to describe the peeling strength of the strong degree of connection, the greater the peeling strength, indicating the connection more firm,withstand high temperature and high humidity (HHBT) and temperatureshock (TS) the stronger of the ability.In order to easily understood, let the reader understand the researchbackground, this paper first describes the TFT-LCD industry, LCDmodules structure and materials production process, detailed account ofthe module’s process. This paper mainly studies ACF bonding process,what factors will affect the peeling strength, which parameters can beadjusted to increase the peeling strength. Analysis of the factors include:bonding temperature, pressure, time, COF film material. Experiment toAC9620as an experimental ACF, through changes to the analysis of theabove four factors, and make the factors on the peeling strength of theimpact of trends, and through trend analysis, the factors obtained thedegree of influence on the peeling strength of the final analysis the mostoptimal conditions for products manufacture. The course of the study, andfor the optimization of the condition of the LCD manufacturing plant tact,product quality, reliability, energy saving, etc. all have a great guidingsignificance.