Preparation Of The High Performance Thermal Interface Materials And Research On The Thermal Contact Resistance

With the development of the microelectronics, the power of the electronic devices is improving, and the heat generated by the devices has increased dramatically, which bring the great challenge to cool the devices. The point of this paper is to prepare the high performance thermal interface materials, in order to reduce the thermal contact resistance between the interfaces and meet the requirement of that the electronic devices can work in safely. The study found that:In this article, the high thermal conductivity of nano copper, MWCNTs, carbon fiber, scaly carbon powder, SiC particles are doped into the epoxy resin matrix as the filler, then the thermal interface material is prepared successfully. Using the SEM to observe the microscopic surface morphology, measuring its thermal conductivity and viscosity. Utilizing The Interface Thermal Contact Resistance Testing Device to measure the thermal contact resistance after filling interfaces with the thermal interface materials.(1)When the filler is nano copper or SiC, it can optimize the thermal conductivity and the thermal contact resistance of the thermal interface materials, especially SiC is treated by the coupling agent. The best composite is filled with80wt%nano copper which’s thermal conductivity is1.21W/(m·k) and thermal contact resistance is10.46mm2K/W.(2)When the fillers are MWCNTs, carbon fiber, scaly carbon powder, the composite filled with scaly carbon powder is the best one, its highest thermal conductivities reaches1.37W/(m·k), and the thermal contact resistance drops to20.4mm2K/W. With the increase of the mass content, the viscosity of the composite increase sharply, the flow performance deteriorates quickly; firstly, the thermal conductivities increases fast, then it increases slowly or decrease; the thermal contact resistance decreases at first then increases.(3)When the filler as MWCNTs、CNF or carbon power is added to the matrix which is the composite with40wt%of Cu, it can promote the thermal conductive network, of course, it will improve the heat transfer. With rising of the mass content, the thermal conductivity increases at first then decreases. When the mass content of the filler is little, the thermal contact resistance is optimized, with the content increases, the flow performance is worse and worse, the boundary resistance increases, the amount of air between the filler raises up, the thermal conductivity decreases, the thermal contact resistance increases.(4) The heat transfer performance of the thermal interface materials is related not only to the thermal conductivity, but also to the other factors such as the property of the filler, the viscosity.