Thermal Degradation Kinetics Of Polyimide Hybrid Film

With the rapid development of modern technology, put forward higher requirementson the performance of material. Because the special performance of heat-resisting of thepolyimide, it was widely used in the area of aerospace and microelectronics. In order toimprove the electrical, thermal, mechanical properties of polyimide film, the polymerwas mixed with inorganic nanoparticles to improve its heating-resistance and make itsthermal aging life increased in certain range. Now, the hybrid polyimide film has becomeone of the polymer materials which has excellent heating resistance. As a result, moreand more scholars are take part in its intensive study.With the study of the application of composite materials, we found that the additionof nanoparticles in the material can make all kinds of its properties improved, for thereason that the nanoparticles has so high specific area that it was used more and morewidely. The addition of nanoparticles improves the heating resistance of the system, so itscombination property is better than raw material, then satisfied the requirements from allareas. Composite material has a new research direction for the discovery ofnanoparticles.In this paper, the thermal stability of the PI/Al₂O₃hybrid film was analysed by TG,then studied its aging test. The activation energy of thermal decomposition of PI wereobtained by using Kissinger method in air atmosphere and nitrogen atmosphere, at thesame time we calculate the collision coefficient. Then, the temperature of aging life ofPI was calculated when the doping content was0wt%,4wt%,8wt%,12wt%,16wt%,20wt%,24wt%. When the doping content was12wt%, we found that the ceilingtemperature for long service could reach318℃and384℃in respective airatmosphere and nitrogen atmosphere.