The Cracking Mechanismand Molding Process Simulation Of Polycarbonate Switch Panel

PC is one of thermoplastic engineering plastics with excellent comprehensiveproperties,which has excellent electrical insulation,extensibility,transparency,size stability,impact strength,chemical resistance and good heat and cold resistance, and it is widelyused in automobiles, electrical and electronic, building,office equipment, packaging, sportsequipment,medical care,household items,aviation,aerospace,computer,CD and so on.PCmaterial is one of the fastest growing engineering plastic in major engineering plastic.Withthe increasing demand for PC material in domestic and international market, the problemof application increasingly appeared.The crack problem of PC materials is particularlyprominent. So based on relevant research project,this paper carried on the comprehensivesystem of theoretical analysis and field test of injection molding for PC switch panelstamping forming process revolving around PC material in a typical daily necessities-cracking mechanism of the switch panel parts and and optimized the technologicalparameters of the injection molding,eliminated the cracking defects of the PC switch panelproducts produced in the actual process of producing.This paper mainly divided into two parts. The first part of the paper is the crackingmechanism analysis of PC switch panel,which mainly including PC material properties testof3different kinds of PC particles,unidirectional tensile test,melt index test of3kinds ofPC particles,the SEM analysis of tensile fracture,cracking resistance test of Different PCmaterial switch panel shell,internal stress experiment tested by Stress polariscope,meltindex test of3kinds of PC particles,solvent method test internal stress experiment,the hightemperature storage experiment for different kinds of PC switch panel shell,the DSC test ofdifferent PC material particles,internal stress test and other physical test of transparent PCswitch panel stamping shell. The second part of the paper is about the analysis of the PCswitch panel by Moldflow software,mainly including the design of the optimal gatelocation,the optimization of technological parameter,the numerical simulation of materials,this paper obtaining the best molding performance of PC switch panel by theexperimental simulation results.Besides,The paper designed orthogonal experiment basedon Moldflow and analyzed of the effect about the four process parameters of moldtemperature,melt temperature,pressure,pressure time to the shark and warp of the switchpanel.To reach the reasonable process scheme,which play a great important role in moldingand mold designing.It can greatly reduce the time and cost of new product development,atthe same time it can greatly improve the successful rate of the test for the enterprise whatcan save the cost and increase of the competitiveness of the enterprises.