| Light emitting diode (LED) has been widely used in lighting, display, backlight and many other fields for its prominent advantages such as high efficiency and eco-friendly properties. With the improvement of the LED brightness and power, high-power LED has higher requirements for ageing-resistant performance, refractive index and transmittance. Traditional epoxy resin which has many problems, such as easily aging, excessive internal stress and poor thermal stability, could not meet the requirements of high-power LED encapsulation materials, and it’s being replaced by silicone materials gradually. However, the refractive index and heat resistance of silicone materials can also be further improved. The main works in this paper are as follow:MOSS containing phenyl hydrogen or vinyl groups were prepared by metal induced salt and silylation with chlorosilane. Moreover, the structures of MOSS were characterized by infrared IR,1H NMR and GPC, and the effects of water, coordinated metal and solvent on metallopolysiloxane complex were investigated. Finally, silicone resin with cyclic network structure was prepared by hydrosilylation of phenyl hydrogen MOSS and vinyl MOSS. The initial degradation temperature of silicone resin is484℃, and fraction of residue is79.6%at1000℃. The results show that the silicone resin has excellent heat resistance.Phenyl vinyl silicone resin and phenyl hydrogen silicone resin were prepared by cohydro lysis polycondensation reaction, and the structures of products were characterized by infrared IR,’H NMR. Furthermore, the effects of water, hydrolysis temperature and catalyst dosage on product were investigated, and phenyl silicone resin was prepared by hydrosilylation of phenyl vinyl silicone resin and phenyl hydrogen silicone resin. The results show that the initial degradation temperature of cured phenyl silicone resin is484℃, fraction of residue is79.7%at1000℃, refractive index is1.518, hardness is88A. |
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