Relationship Between Diffusion Heat-treatment Processing And Cold-rolled Cu/Al Composite Laminate Performance

According to the problems of pure copper as bus-bars with high cost and theshortage of the copper resource, the rolling technique of copper and aluminum compositelaminate has been studied for substituting the pure copper bus-bars. Copper andaluminum composite laminate has a low surface resistance compared to pure aluminumbus-bar, and the electricity of Copper and aluminum composite laminate is near purecopper conductor. It is the important development direction of bus line materials.The experiment has taken composite algorithm of cold rolling to prepare copper andaluminum composite laminate, and then conducted annealing heat treatment. Copper andaluminum composite laminate peel strength measuring device is designed. It has beentested that the conductivity, tensile and binding performance of Cu/Al compositelaminate with heat treatment. It has been analyzed that the effect of heat treatment on theperformance, then optimized the processing parameter of heat treatment. The over-allproperties of Cu/Al composite laminate have been measured. It has been simulateed theworking condition of Cu/Al composite laminate, then evaluated character of service. Themain research results are as follows: The interface diffusion layer of Cu/Al compositelaminate is adding with the increasing of heat treatment time. The growth rate ofdiffusion layer is different of treatment temperature. The Peel strength and electricalconductivity of Cu/Al composite laminate increase first and then decreases with the heattreatment. It is becouse that Cu/Al composite laminate is mechanical bond at first, andthen it become metallurgical bonding. However following the heat treatmentintermetallic compounds are also increasing. It Reduces the bond strength and electricalconductivity of Cu/Al composite laminate finally. But There is no effect on Cu/Alcomposite laminate strength of extension and elongation. The best heat treatment processof Cu/Al composite laminate is8h,300℃. In this state the trical conductivity is95.9%IACS, the tensile strength is133.28Mpa, the elongation is24.3%, bonding strength ofthe composite board is1786.3N/m. After1000hours of use the performance test, it is concluded that Cu/Al composite laminate has stable performance within1000hours ofuse.