The Research Of Testing And Analysis Technology Of Semiconductor Lighting Products Thermal Properties

With the continuous development of semiconductor lighting technology,semiconductor lighting products has been widely applied in the field of more andmore lighting. It makes the semiconductor lighting be increasingly widespreadconcern around the world. Because the LED have a series of advantages, such ashigh efficiency, energy saving, environmental protection, long life and so on, soit is known as the incandescent light bulb after the fourth generation of lightingsource. But thermal problems is one of the main factors that restrict it into thelighting area, therefore, how to test the heat dissipation problem of the semicon-ductor lighting products in the application is one of the key issues of place, needto be solved in the future.First of all, this subject from the thermal characteristics of semiconductorlighting products, have done the further research work for its test method ofthermal characteristic, a detailed discussion on this subject research purpose andsignificance and the development trend of the future, as well as its research statusof thermal characteristic test technology. The researching is the instruction ofjunction and thermal resistance are effect on the thermal properties. And thendiscussing the method to test the thermal characteristics analysis technology atpresent, according to the study of basic theory of junction temperature, and comeup with a new method of junction temperature testing technology. It provides thetheoretical support for the analysis of thermal characteristics of the semiconduc-tor lighting products.Secondly, we had the thermal performance influence factors from three as-pects, respectively is the luminous flux, the forward voltage, also service life. Then summarize the three ways of heat transfer and heat radiation structure forsemiconductor lighting products are. Moreover, we had a detailed analysis onthermal conductivity, such as the heat conduction material and thermal properties,through the establishment of Cauer thermal network model, using structure func-tion method for the analysis of semiconductor device of heat parameter. To someextent, this model can reflect the internal heat transfer structure, and whether bymeans of belt in the process of heat conduction glue on the radiator thermal resis-tance of each part are researched in detail.Finally, we had an experimental test in application lamps using the proposedtest method and simulation analysis were compared to verify the feasibility of thetest method, and calculated junction a mild thermal resistance of the error in thetesting process analysis.